FLIR Releases Micro Thermal Imaging Camera Core



By Danielle Lucey



FLIR Systems Inc. has announced that it has released the FLIR Lepton thermal imaging camera core. 



The core is similar in size, weight and power use to a conventional cell phone camera module and is microbolometer based. Lepton uses wafer-level detector packaging, wafer-level micro-optics and a custom integrated circuit on an integrated low-power chip. The new product is compatible with FLIR’s Multi-Spectral Dynamic Imaging technology. 



“FLIR is committed to the development of lower cost, user-friendly thermal sensing technologies to enhance vision and measurement beyond light. Lepton represents our latest, most dramatic step toward our vision of becoming the world’s sixth sense,” says Andy Teich, president and CEO of FLIR.